Set4CIP
Multiscale multigrid simulator of electro thermo mechanical
processes in integrated power circuits

Period: 2016. Contract no.: 83BG/2016

• Improve simulation time and accuracy for the chip level thermo-mechanical simulations by Optimized meshing Optimized structure modeling
• Macro-Meso-Micro (multiscale/multigrid) modeling
• Validation of the multiscale/multigrid approach with the equivalent simulation results and measurements obtained by INFINEON

iDev4.0 - Integrated Development 4.0

H2020 ECSEL

Period: 2019-2021. Project No. 122386. Grant: 527.074 Euro

• Activity A1: Reliability analysis → efficient modelling of electro-thermo-mechanical stress during fast power cycling operation of power PCI in order to correctly predict the failure position and enable relative reliability comparison between design variants
• Activity A2: Yield estimation flows extension of the distribution modelling together with other statistical approaches to estimate the yield taking into account also the correlations between test parameters.